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TPD1052F 2012-01-20 1 toshiba intelligent power device silicon monolithic power mos integrated circuit TPD1052F high-side power switch for motor, solenoid and lamp drivers the TPD1052F is a monolithic power ic intended for high-side load switching applications. the input can be directly driven from cmos or ttl logic (e.g., an mpu). the TPD1052F provides intelligent protection and diagnostic functions. features z a structure that incorporates bi-cmos control circuitry and a power mosfet (dmos) on a single chip. z one side of the load can be grounded. z can be directly driven from a microprocessor. z overtemperature and load short-circ uit (overcurrent) protections are built in. z incorporates a diagnosis function that allows diagnosis output to be read externally at load short (overcurrent), overtemperature. z low on- resistance. : r ds(on) = 0.8 ? (max) @v dd = 12v, i o = 0.5a, t ch =25 z low supply current. : i dd = 10 a (max), @v dd = 12v, v in = 0v, t ch =25 z housed in the ps-8 package and supplied in embossed carrier tape. pin assignment (top view) marking note: that because of its mos structure, this product is sensitive to static electricity. son8-p-0303-0.65 weight: 0.017g (typ.) v dd 1 n.c 2 in 3 gnd 4 8 out 7 n.c 6 diag 5 mask lot no. 1052f part no. (or abbreviation code) ? note: on the lower left of the marking indicates pin 1 weekly code: (three digits) week of manufacture (01 for first week of year, continuing up to 52 or 53) year of manufacture (the last digit of the calendar year) please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. the rohs is the directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain
TPD1052F 2012-01-20 2 block diagram pin description pin no. symbol function 1 v dd power supply pin. 2, 7 n.c no-connect pin. 3 in input pin. the in pin has an internal pull-down resistor. even if the in pin is open, the output will not accidentally turn on. 4 gnd ground pin. 5 mask overcurrent detection/protection is i oc(clamp) in the mask time. if the capacitor and the resistance is not connec ted to mask pin, overcurrent protection is i oc(duty) . 6 diag self-diagnosis detection pin. npn open collector. when input is ?h?(output on), and overcurrent or overtemperature is detected, diag becomes low level and it is latched. when input is low level, the state of latch is reseted. 8 out output pin. when a load short-circ uit causes an overcurrent (0.8a min) to flow into a device, output current is limited in order to protect the ic. v dd out 5v regulator driver overcurrent detection overtemperature detection diag gnd in diagnosis logic logic mask mask time in 12v 5v r mask c mask
TPD1052F 2012-01-20 3 timing chart truth table input signal output mosfet state diagnosis output operating state h on h l off h normal t t mask (note) current limiting (clamp) h h t > t mask (note) current limiting (switching) l (latch) l off h overcurrent (load short-circuit) h off (latch) l (latch) l off h overtemperature note : t is time from the v in =h input. input voltage v in load short-circuit (mask time is set) output current i o channel temperature t ch diagnosis voltage v diag overtemperature detection ( latch ) output voltage v out normal (output on) overcurrent detection (latch) current limited (clamp) current limited (switching) load short-circuit (mask time is not set) mask time t mask overtemperature detection overcurrent detection (latch) shutdown (latch) i oc(clamp) i oc(duty) mask voltage v mask
TPD1052F 2012-01-20 4 absolute maximum ratings (t a = 25c) note: using continuously under heavy loads (e.g. the application of high temperatur e/current/voltage and the significant change in temperature, etc. ) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operatin g temperature/current/voltage, etc. ) are within the absolute maximum ratings and the operating ranges. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). thermal resistance characteristics symbol rating unit 178.6(note 1a) thermal resistance, channel to ambient r th (ch?a) 357.2(note 1b) c / w note 1: (a) glass epoxy board (b) glass epoxy board characteristics symbol rating unit drain-source voltage v ds 40 v dc v dd (1) -0.3 to 25 v supply voltage pulse v dd (2) 40 (t 200ms) v input voltage v in ? 0.3 to 6 v diagnosis output voltage v diag ? 0.3 to 6 v output current i o internally limited a diagnosis output current i diag 5 ma power dissipation (note 1a) p d(1) 0.7 power dissipation (note 1b) p d(2) 0.35 operating temperature t opr ? 40 to 125 c channel temperature t ch 150 c storage temperature t stg ? 55 to 150 c glass epoxy board material fr-4 25.4mm 25.4mm 0.8mm glass epoxy board material fr-4 25.4mm 25.4mm 0.8mm
TPD1052F 2012-01-20 5 electrical characteristics (unless otherwise specified t ch = ? 40 to 125c, v dd = 5 to 18v) characteristics symbol test circuit test condition min typ. max unit operating supply voltage v dd (opr) ? ? 5 12 18 v supply current i dd ? v dd = 12v, v in = 0v, output open. ? ? 10 a output leakage current i ol ? v in = v out =0v ? ? 10 a v ih ? v dd = 8 to 18v 2.0 ? ? v input voltage v il ? v dd = 8 to 18v ? ? 0.8 v i in (1) ? v in = 5v ? ? 200 a input current i in (2) ? v in = 0v 0.2 ? 0.2 a drain-source on-resistance r ds (on) ? v dd = 8 to 18v, i o = 0.5a, v in = 5v, t ch = 25c ? 0.5 0.8 ? diagnosis output voltage low level v dl ? i diag = 1ma ? ? 0.4 v diagnosis output current high level i dh ? v diag = 5v ? ? 10 a i oc(clamp) ? 1.2 1.7 2.3 a overcurrent detection i oc(duty) ? v dd = 8 to 18v 0.8 1.3 1.8 a overtemperature detection t ot ? ? 150 160 200 c mask time(note 2) t mask ? c mask =0.033 f, r mask =1m , v dd =8 to 18v, t ch =25 ? 3.8 ? ms t on 1 1 10 30 s switching times t off 1 v dd = 12v, r l = 24 , t ch = 25c 1 20 60 s note 2: about the mask time function mask time function is built in TPD1052F. mask time is decided to prevent discharge electricity by switching-mode overcurrent protection that occur by inrush current. to prevent discharge electricity by overcurrent protection(switching) that operate by inrush current, mask time is used. overcurrent protection is clamp current in mask time from v in =h. mask time can roughly set at nether expression. ? ? ? ? ? ? ? ? ??= mask r ref r 1ln mask r mask c mask t [s] r ref : internal resistance 110k (typ.) when the mask time is changed, please change c mask in the state of r mask =1m . when overcurrent protection(clamp) is operating, TPD1052F becomes high temperature. therefore please set mask time for channel temperature to become 150 or less. if you do not use mask time, please open the mask pin.
TPD1052F 2012-01-20 6 test circuit 1 switching times application circuit i oc(clamp) v in t mask i out v out capacitor charge time mask time tr 0.1 st f 0.1 s t on t off v in v out 90% 90% 10% 10% 90% 10% in v dd out gnd 24 diag mask p.g 12v v out in v dd out gnd 24 diag mask p.g 12v v out 5v 12v 10k 1m mpu mpu load in v dd out gnd diag mask 5v 12v 10k 1m mpu mpu load in v dd out gnd diag mask
TPD1052F 2012-01-20 7 0.0 1.0 2.0 3.0 4.0 5.0 -80 - 40 0 40 80 120 160 0.0 1.0 2.0 3.0 4.0 5.0 04 8121 620 0 2 4 6 8 10 - 80 -40 0 40 80 120 160 0 2 4 6 8 10 048121620 supply current i dd [ a] supply voltage v dd [v] i dd - v dd t ch =25 v in =0v out p ut o p en supply current i dd(on) [ma] supply voltage v dd [v] i dd(on) - v dd t ch =25 v in =5v out p ut o p en supply current i dd [ a] channel temperature t ch [ ] i dd - t ch supply current i dd(on) [ma] channel temperature t ch [ ] i dd(on) - t ch v dd =12v v in =5v out p ut o p en v dd =12v v in =0v out p ut o p en 0.4 0.8 1.2 1.6 2.0 2.4 -80 - 40 0 40 80 120 160 0.4 0.8 1.2 1.6 2.0 2.4 04 8121620 input voltage v ih ,v il [v] supply voltage v dd [v] v ih ,v il - v dd t ch =25 input voltage v ih ,v il [v] channel temperature t ch [ ] v ih ,v il - t ch v dd =12v v ih v il v ih v il
TPD1052F 2012-01-20 8 0.0 0.2 0.4 0.6 0.8 1.0 -80 - 40 0 40 80 120 160 0.0 0.2 0.4 0.6 0.8 1.0 04 8121620 0 40 80 120 160 200 -80 -40 0 40 80 120 160 0 40 80 120 160 200 02468 input current i in [ a] input voltage v in [v] i in ? v in t ch =25 drain-source on-resistance r ds(on) [? ] supply voltage v dd [v] r ds(on) - v dd input current i in(1) [ a] channel temperature t ch [ ] i in(1) - t ch v in =5v drain-source on-resistance r ds(on) [? ] channel temperature t ch [ ] r ds(on) - t ch t ch =25 i o =0.5a v in =5v v dd =12v i o =0.5a v in =5v 0.0 0.1 0.2 0.3 0.4 0.5 -80 - 40 0 40 80 120 160 0.0 0.1 0.2 0.3 0.4 0.5 04 8121620 diagnosis output voltage v dl [v] supply voltage v dd [v] v dl - v dd t ch =25 i diag =1ma diagnosis output voltage v dl [v] channel temperature t ch [ ] v dl - t ch v dd =12v i diag =1ma
TPD1052F 2012-01-20 9 0.0 0.4 0.8 1.2 1.6 2.0 -80 - 40 0 40 80 120 160 0.0 0.4 0.8 1.2 1.6 2.0 04 8121620 0.0 1.0 2.0 3.0 4.0 -80 - 40 0 40 80 120 160 0.0 1.0 2.0 3.0 4.0 04 8121620 overcurrent detection i oc(clamp) [a] supply voltage v dd [v] i oc(clamp) - v dd t ch =25 v mask =l overcurrent detection i oc(duty) [a] supply voltage v dd [v] i oc(duty) - v dd overcurrent detection i oc(clamp) [a] channel temperature t ch [ ] i oc(clamp) - t ch v dd =12v v mask =l overcurrent detection i oc(duty) [a] channel temperature t ch [ ] i oc(duty) - t ch t ch =25 v dd =12v 0 10 20 30 40 50 -80 - 40 0 40 80 120 160 0 10 20 30 40 50 048121620 switching times t on ,t off [ s] supply voltage v dd [v] t on ,t off - v dd t ch =25 r l =24 switching times t on ,t off [ s] channel temperature t ch [ ] t on ,t off - t ch v dd =12v r l =24 t off t on t off t on
TPD1052F 2012-01-20 10 0.1 1 10 100 1000 0.001 0.01 0.1 1 10 100 1000 overtemperature detection t ot [] supply voltage v dd [v] t ot ? v dd power dissipation p d [w] ambient temperature ta[ ] p d - ta 150 160 170 180 190 200 0 4 8 12 16 20 0.0 0.2 0.4 0.6 0.8 1.0 -40 0 40 80 120 160 (1) thermal resistance r th [/w] pulse width t w [s] r th - t w (2) (1) mount on glass epoxy board (a)(note 1a) (2) mount on glass epoxy board (b)(note 1b) (1) (2) single pulse (1) mount on glass epoxy board (a)(note 1a) (2) mount on glass epoxy board (b)(note 1b)
TPD1052F 2012-01-20 11 package dimensions unit; mm weight 0.017g (typ.) 0.330.05 2.40.1 0.80.05 0.330.05 0.475 0.65 0.170.02 2.80.1 s a 0.05 m b 2.90.1 0.28 +0.1 -0.11 0.28 +0.1 -0.11 1.12 +0.13 -0.12 1.12 +0.13 -0.12 b 0.05 m a s 0.025
TPD1052F 2012-01-20 12 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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